Beyond Moore: Three-Dimensional (3D) Heterogeneous Integration
Guest Editors:
Yue Hao
Huaqiang Wu
Yuchao Yang
Qi Liu
Xiao Gong
Genquan Han
Ming Li
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Design technology co-optimization towards sub-3 nm technology nodes
2021, 42(2): 020301, doi: 10.1088/1674-4926/42/2/020301
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Mobility enhancement techniques for Ge and GeSn MOSFETs
2021, 42(2): 023101, doi: 10.1088/1674-4926/42/2/023101
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Towards electronic-photonic-converged thermo-optic feedback tuning
2021, 42(2): 023104, doi: 10.1088/1674-4926/42/2/023104
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The effect of γ-ray irradiation on the SOT magnetic films and Hall devices
2021, 42(2): 024102, doi: 10.1088/1674-4926/42/2/024102
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Integration of GaN analog building blocks on p-GaN wafers for GaN ICs
2021, 42(2): 024103, doi: 10.1088/1674-4926/42/2/024103