Fabrication of 0.1 Micron MOSFETs and Their Characteristics
Chin. J. Semicond. 2000, 21(9): 833
Multiple Quantum Well SEED Arrays for Flip-Chip Bonding Optoelectronic Smart Pixels
Chin. J. Semicond. 2000, 21(9): 839
High-Speed CMOS Sample- and-Hold Amplifier
Chin. J. Semicond. 2000, 21(9): 843
Improvement in Electrical Properties of SIMNI Films by Multiple-Step Implantation
Chin. J. Semicond. 2000, 21(9): 849
Solving Schrodinger Equation with Non-Uniform Grids by Scale Transformation Method
Chin. J. Semicond. 2000, 21(9): 853
Novel Oxide Trap Behavior in Ultra Thin Gate and Its Study by PDO Method
Chin. J. Semicond. 2000, 21(9): 857
用固相外延方法制备Si_(1-x-y)Ge_xC_y三元材料
Chin. J. Semicond. 2000, 21(9): 862
Chin. J. Semicond. 2000, 21(9): 867
Chin. J. Semicond. 2000, 21(9): 872
Chin. J. Semicond. 2000, 21(9): 877
Chin. J. Semicond. 2000, 21(9): 882
Chin. J. Semicond. 2000, 21(9): 887
一种用于手写体数字分类的可编程Hamming神经网络特征提取器
Chin. J. Semicond. 2000, 21(9): 892
Chin. J. Semicond. 2000, 21(9): 898
Chin. J. Semicond. 2000, 21(9): 904
Chin. J. Semicond. 2000, 21(9): 914
Chin. J. Semicond. 2000, 21(9): 918
Chin. J. Semicond. 2000, 21(9): 922
Chin. J. Semicond. 2000, 21(9): 927
MBE生长的高质量AlGaAs/InGaAs双δ掺杂PHEMT结构的材料
Chin. J. Semicond. 2000, 21(9): 934