Ti/4H-SiC Schottky Barrier Diodes with Field Plate and B+ Implantation Edge Termination Technology
Chin. J. Semicond. 2007, 28(9): 1333
Driving Circuit for AMOLED with Fault Tolerance
Chin. J. Semicond. 2007, 28(9): 1337
A High Speed,12-Channel Parallel,Monolithic IntegratedCMOS OEIC Receiver
Chin. J. Semicond. 2007, 28(9): 1341
A Novel Power Supply Solution of a Passive RFID Transponder
Chin. J. Semicond. 2007, 28(9): 1346
Subsurface Damage in the Monocrystal Silicon Grinding on Atomic Scale
Chin. J. Semicond. 2007, 28(9): 1353
A Novel Fully-Depleted Dual-Gate MOSFET
Chin. J. Semicond. 2007, 28(9): 1359
CMOS Quadrature Modulator and Up-Conversion Mixer for802.11a Wireless LAN Systems
Chin. J. Semicond. 2007, 28(9): 1364
Mismatch Calibration Techniques in Successive Approximation Analog-to-Digital Converters
Chin. J. Semicond. 2007, 28(9): 1369
Chin. J. Semicond. 2007, 28(9): 1375
Interband Optical Transitions in Semiconducting Iron Disilicide β-FeSi2
Chin. J. Semicond. 2007, 28(9): 1381
Photoluminescence Properties of Er-Doped HfO2 Films
Chin. J. Semicond. 2007, 28(9): 1388
Theoretical Calculation of Conversion Efficiency of InGaN Solar Cells
Chin. J. Semicond. 2007, 28(9): 1392
Conductivity and Conducting Mechanism of Polypyrrole via Chemical Oxidative Polymerization
Chin. J. Semicond. 2007, 28(9): 1396
Influence of Ag Layer Thickness on the Properties of ZnO/Ag/ZnO Films
Chin. J. Semicond. 2007, 28(9): 1402
Bi2O3-ZnO-Nb2O5 Film Fabricated by Sol-Gel Technique and C-V Characteristic of GaN MIS Structure
Chin. J. Semicond. 2007, 28(9): 1406
Growth of AlGaAs on GaAs (110) Surface by Molecular Beam Epitaxy
Chin. J. Semicond. 2007, 28(9): 1411
Fabrication of a Novel SOI Material with Non-Planar Buried Oxide Layer
Chin. J. Semicond. 2007, 28(9): 1415
Chin. J. Semicond. 2007, 28(9): 1420
Chin. J. Semicond. 2007, 28(9): 1424
Breakdown Characteristic of Multiregion Double RESURF LDMOS with High Voltage Interconnection
Chin. J. Semicond. 2007, 28(9): 1428
Analysis of Early Voltage in 4H-SiC BJTs
Chin. J. Semicond. 2007, 28(9): 1433
A 22-Element Small-Signal Model of GaN HEMT Devices
Chin. J. Semicond. 2007, 28(9): 1438
RTS Amplitude of 90nm MOS Devices in Sub-Threshold Region
Chin. J. Semicond. 2007, 28(9): 1443
RF-CMOS Modeling:An Improved Accumulation-Mode MOS Varactor Model
Chin. J. Semicond. 2007, 28(9): 1448
A Tunable Micromechanical Capacitor Driven by Electrostatic Force
Chin. J. Semicond. 2007, 28(9): 1454
Analytical Solutions for Thermal Stresses in the Core of Silica-on-Silicon Waveguide
Chin. J. Semicond. 2007, 28(9): 1459
Simulation of SU-8 Photoresist Profile in Deep UV Lithography
Chin. J. Semicond. 2007, 28(9): 1465
Chin. J. Semicond. 2007, 28(9): 1471
Novel Driver for Class-D Audio Power Amplifier
Chin. J. Semicond. 2007, 28(9): 1477
Chin. J. Semicond. 2007, 28(9): 1482
A CMOS Sampling Switch for 14bit 50MHz Pipelined A/D Converter
Chin. J. Semicond. 2007, 28(9): 1488